Materials containingÌýper and poly-fluoroalkyl substances (PFAS)Ìýhave become a cornerstone of functionality in semiconductor manufacturing becauseÌýofÌýtheir unique chemical properties.ÌýIn the case of surfactants, PFAS areÌývital to enabling surface coat uniformity, complete resist removal with low defectivity, improvedÌýline roughness and reduced line collapse.ÌýThis paper presents case studies onÌýthe removal of PFAS-containing surfactants in lithographic materials.ÌýThere is no drop-in solution that would fit all surfactant use applications, however, making the replacements of these materials costly and time-consuming. Full replacement of PFAS-containing materials may not be possible for some of the most exacting applications.ÌýÌýÌý
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