This paper听outlines听the necessary attributes听for successful semiconductor manufacturing听of PFAS used in plasma etch and deposition, including but not limited to reaction rates and selectivity and surface reaction characteristics.听Additionally, this paper听discusses听non-PFAS alternative compounds where available, as well as efforts to develop alternatives.听Finally,听we鈥檒l听explore the听potential release/exposure pathways of these materials from semiconductor fabrication (fab)听facilities and mitigation options.听
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